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News

Digital signal controllers offer high PWM resolution
01 July 2025 г.
Microchip Technology has added the dsPIC33AK512MPS512 and dsPIC33AK512MC510 Digital Signal Controller (DSC) families to its dsPIC33A DSC product line.
1Tbyte NAND memory with 321 layers fits in AI smartphones
04 June 2025 г.
Sk Hynix has launched a NAND memory with 321 layers that is 0.85mm high to fit into flagship AI smartphone designs
MPU for HMI applications cuts costs and drives performance
19 May 2025 г.
Renesas Electronics Corporation has introduced a new high-performance microprocessor (MPU) in the RTOS-based RZ/A series that meets the growing demands of advanced human-machine interface (HMI) systems.
Samsung to ship first 2Tbyte automotive SSD
09 October 2024 г.
Samsung Electronics has  developed the industry’s first PCIe 4.0 automotive solid state disk (SSD) based on eighth-generation vertical NAND (V-NAND) with a 2Tbyte version shipping in early 2025.
Nexperia adds 20 power BJT devices in DFN2020D-3 packaging
03 September 2024 г.
Nexperia has added 20 power bipolar junction transistors (BJTs) to its range with ten standard and ten automotive-qualified products in DFN2020D-3 packaging.
MCUs target motor control and power conversion
06 August 2024 г.
Infineon Technologies AG has introduced a new series of microcontrollers (MCUs) for next-generation industrial and consumer motor control as well as power conversion system applications.
First AVX waterproof poke-home connector
04 July 2024 г.
Kyocera AVX has launched its first waterproof ‘poke home’ IP67 waterproof wire-to-wire connector family.
Third generation SiC for AI data centres, EV charging
13 June 2024 г.
Navitas Semiconductor has launched a series of silicon carbide (SiC) switches for data centre and automotive applications.
Top-side cooled 600-V power MOSFET delivers low on resistance
08 May 2024 г.
To provide higher efficiency and power density for telecom, industrial, and computing applications, Vishay Intertechnology has introduced its first fourth-generation 600-V E Series power MOSFET in the new PowerPAK® 8 x 8LR package.
Edge MCUs meet PSA Level 4 certification requirements
12 April 2024 г.
Infineon Technologies AG has announced that its PSOC™ Edge E8x family of microcontrollers (MCUs) has been designed to meet the highest certification level provided by the Platform Security Architecture (PSA) Certified program, a framework for embedded security.