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News

Reed relay has minimum stand-off of 1500V
12 March 2020 г.
The Series 131 reed relay from Pickering Electronics has a height of 6.6mm and a minimum stand-off of 1500V. Pickering Electronics has launched what the company claims to be the industry’s smallest high voltage reed relay.
4Gbps LVDT IC aggregates up to 37 different I/Os
05 February 2020 г.
Thine Electronics’ THCS251 GPIO / LVCMOS transceiver IC allows engineers to aggregate up to 37 lines of different data rates into just 4 lines that can be received and transmitted in the same IC.
STM32 SoC gives LoRa IoT connectivity a boost
16 January 2020 г.
STMicroelectronics announced what the company claims to be the world’s first LoRa system-on-chip (SoC) for connecting smart devices to the Internet of Things, using long-distance wireless connections.
Wideband RF transceiver reduces base station costs
02 December 2019 г.
Analog Devices' ADRV9026 wideband transceiver is designed to support base station applications including single and multi-standard 3G/4G/5G macrocell base stations, massive MIMO (M-MIMO) and small cell systems.
The STM32Cube Ecosystem now supports LoRaWAN FUOTA
08 November 2019 г.
STMicroelectronics has enhanced its STM32 LoRaWAN software expansion package for developers (I-CUBE-LRWAN) to support the latest Firmware Update Over The Air (FUOTA) specifications.
MEMS thermopile vacuum sensors effective from 1 millitorr to 1 atm
04 October 2019 г.
The PVC3000 series of MEMS thermopile vacuum sensors from Posifa Technologies deliver a wide effective range from 1 millitorr (0.13 Pa) to 1 atm (760 torr, or 101 kPa) to eliminate the need for additional sensing technology and to lower overall solution costs.
PCIe Gen4 NVMe SSD controllers are low power
03 September 2019 г.
Marvell has unveiled what it claims to be the industry’s lowest power PCIe Gen4 NVMe solid-state drive (SSD) controller portfolio. The SSD controllers are designed to meet the need for lower power and higher performance in next-generation data centers and edge devices as artificial intelligence (AI) and 5G gain momentum.
Compact debug probe accelerates STM32 application development
02 August 2019 г.
The STLINK-V3MINI probe combines the enhanced features of STLINK-V3SET with standalone simplicity for faster programming and ease of use, for an even more affordable price, at just $9.75.
Near-infrared ultra-low light image sensors reach 4Mpixels
02 July 2019 г.
OmniVision Technologies’ OS04A10 is a 2.9 micron pixel image sensor with 4 megapixel (MP) resolution. Part of the company’s Nyxel near-infrared (NIR) and ultra-low light (ULL) sensors, the OS04A10 provides security cameras with greater zoom range and AI-enabled surveillance systems with better object identification and facial authentication accuracy.
Ultrasound MEMS transducers support sub-centimetre gesture recognition
17 June 2019 г.
Researchers at the Fraunhofer Institute for Photonic Microsystems (IPMS) have developed a new class of ultrasound transducers to reliably detect distance changes, movement patterns, and gestures in ranges of up to half a meter.