News

Toshiba Electronics Europe GmbH has started mass production of new microcontrollers (TMPM3HxF10xx) in the M3H group of the TXZ+™ Family Advanced Class, manufactured in a 40nm process.

With the NINA-B5 module, Swiss module vendor u-blox has introduced its first Bluetooth LE automotive product. The device series is based on the NXP KW45 chipset and stands out with advanced security (e.g., NXP EdgeLock, Arm TrustZone), as well as a range of interfaces that are typical in the automotive world.

Power distribution in modern vehicles requires adjustable overcurrent limiting and capacitive load mode. For this purpose, Infineon has developed a family of smart load-guard switches.

EInfochips, a leading provider of product engineering and digital transformation services, has announced the launch of a Reference Development Platform (RDP) based on the NXP® Semiconductors i.MX 93 applications processors, designated EIC-i.MX93-210.

Radar technology for vehicles is developing rapidly, with range and resolution, including vertical, reaching new dimensions. To enable more demanding applications with this, NXP has developed a new radar SoC.

TDK has launched six new configurations of its 7.5kW programmable DC power supplies.

The Airfast® A5M36TG140 from NXP Semiconductors is a Fully Integrated Doherty Power Amplifier Module that operates from 3400 to 3800 MHz

Renesas Electronics has developed the industry’s first RISC-V MCU specifically optimized for motor control systems.

Credo Technology in the US has launched a family of digital signal processing chips for 800Gbit/s interconnect in data centres.

Nvidia is shipping the first in a series of four Jetson Orin-based modules via distribution for engineers working on their own robotics projects.